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fn6299 rev 5.00 page 1 of 12 july 18, 2014 fn6299 rev 5.00 july 18, 2014 isl9003a low noise ldo with low i q and high psrr datasheet isl9003a is a high performance single low noise, high psrr ldo that delivers a continuous 150ma of load current. it has a low standby current and is stable with 1f of mlcc output capacitance with an esr of up to 200m ? . the isl9003a has a very hig h psrr of 90db and output noise is 20v rms (typical). when c oupled with a no load quiescent current of 31a (ty pical), and 0.5a shutdown current, the isl9003a is an ideal choice for portable wireless equipment. the isl9003a comes in many fi xed voltage options with 1.8% output voltage accuracy over temperature, line and load. other output voltage op tions are available on request. pinouts isl9003a (5 ld sc-70) top view isl9003a (6 ld 1.6x1.6 tdfn) top view features ? high performance ldo with 150ma continuous output ? excellent transient respons e to large current steps ? excellent load regulation: <0.1% voltage change across full range of load current ? very high psrr: >90db at 1khz ? wide input voltage cap ability: 2.3v to 6.5v ? extremely low quiescent current: 31a ? low dropout voltage: typically 200mv at 150ma ? low output noise: typically 20v rms at 100a (1.5v) ? stable with 1f to 4.7 f ceramic capacitors ? shutdown pin turns off ldo with 1a (max) standby current ? soft-start limits input current surge during enable ? current limit and overheat protection ? 1.8% accuracy over all operating conditions ? 5 ld sc-70 package or 6 ld tdfn package ? -40c to +85c operating temperature range ? pb-free (rohs compliant) applications ? pdas, cell phones and smart phones ? portable instruments, mp3 players ? handheld devices including medical handhelds vin gnd en vo cbyp 1 2 3 5 4 nc 5 vo gnd cbyp vin en 1 2 3 6 4 5
isl9003a fn6299 rev 5.00 page 2 of 12 july 18, 2014 ordering information part number ( note 1 ) part marking v o voltage (v) ( note 2 ) temp. range (c) package pb-free tape and reel pkg. dwg. isl9003aienz-t ( notes 3 , 4 ) cbk 3.30 -40 to +85 5 ld sc-70 p5.049 ISL9003AIEMZ-T ( notes 3 , 4 ) cbj 3.00 -40 to +85 5 ld sc-70 p5.049 isl9003aiekz-t ( notes 3 , 4 ) cce 2.85 -40 to +85 5 ld sc-70 p5.049 isl9003aiejz-t ( notes 3 , 4 ) ccd 2.80 -40 to +85 5 ld sc-70 p5.049 isl9003aiehz-t ( notes 3 , 4 ) ccc 2.75 -40 to +85 5 ld sc-70 p5.049 isl9003aierz-t ( notes 3 , 4 ) cdz 2.60 -40 to +85 5 ld sc-70 p5.049 isl9003aiefz-t ( notes 3 , 4 ) ccb 2.50 -40 to +85 5 ld sc-70 p5.049 isl9003aiecz-t ( notes 3 , 4 ) cby 1.80 -40 to +85 5 ld sc-70 p5.049 isl9003aiebz-t ( notes 3 , 4 ) cbw 1.50 -40 to +85 5 ld sc-70 p5.049 isl9003airubz-t ( note 5 ) l 1.50 -40 to +85 6 ld tdfn l6.1.6x1.6a isl9003airucz-t ( note 5 ) g 1.80 -40 to +85 6 ld tdfn l6.1.6x1.6a isl9003airufz-t ( note 5 ) f 2.50 -40 to +85 6 ld tdfn l6.1.6x1.6a isl9003airurz-t ( note 5 ) m2 2.60 -40 to +85 6 ld tdfn l6.1.6x1.6a isl9003airuhz-t ( note 5 ) h 2.75 -40 to +85 6 ld tdfn l6.1.6x1.6a isl9003airujz-t ( note 5 ) j 2.80 -40 to +85 6 ld tdfn l6.1.6x1.6a isl9003airukz-t ( note 5 ) k 2.85 -40 to +85 6 ld tdfn l6.1.6x1.6a isl9003airumz-t ( note 5 ) m 3.00 -40 to +85 6 ld tdfn l6.1.6x1.6a isl9003airunz-t ( note 5 ) n 3.30 -40 to +85 6 ld tdfn l6.1.6x1.6a notes: 1. please refer to tb347 for details on reel specifications. 2. for other output voltages, contact intersil marketing. 3. the part marking is located on the bottom of the part. 4. these intersil pb-free plastic packaged products employ speci al pb-free material sets, molding compounds/die attach material s, and 100% matte tin plate plus anneal (e3 termination finish, which is ro hs compliant and compatible with both snpb and pb-free solderin g operations). intersil pb-free products are msl classified at pb-free peak re flow temperatures that meet or exceed the pb-free requirements of ipc/jedec j std-020. 5. these intersil pb-free plastic packaged products employ speci al pb-free material sets; molding compounds/die attach material s and nipdau plate - e4 termination finish, w hich is rohs compliant and comp atible with both snpb and pb-free soldering operations. intersi l pb-free products are msl classified at p b-free peak reflow temperatures that meet or exceed the pb-free requirements of ipc/jedec j st d-020.
isl9003a fn6299 rev 5.00 page 3 of 12 july 18, 2014 absolute maximum ratings thermal information supply voltage (v in ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7.1v v o pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +3.6v all other pins . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v to (vin + 0.3v) recommended operating conditions ambient temperature range (t a ) . . . . . . . . . . . . . . .-40c to +85c supply voltage (vin) . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3v to 6.5v thermal resistance ? ja (c/w) 5 ld sc-70 package ( note 6 ) . . . . . . . . . . . . . . . . . 231 6 ld tdfn package ( note 7 ) . . . . . . . . . . . . . . . . 125 junction temperature range . . . . . . . . . . . . . . . . .-4 0c to +125c operating temperature range . . . . . . . . . . . . . . . . .-4 0c to +85c storage temperature range . . . . . . . . . . . . . . . . . .-6 5c to +150c pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . see tb493 caution: do not operate at or near the maximum ratings listed fo r extended periods of time. exposure to such conditions may adv ersely impact product reliability and result in failures not covered by warranty. notes: 6. ? ja is measured with the component mounted on a high effective the rmal conductivity test board in free air. see tech brief tb379 for details. 7. ? ja is measured in free air with the component mounted on a high e ffective thermal conductivity t est board with direct attach f eatures. see te c h b r i e f tb379 . electrical specifications unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature range of the device as follows: t a = -40c to +85c; v in = (v o + 0.5v) to 6.5v with a minimum v in of 2.3v; c in =1f; c o = 1f; c byp = 0.01f. parameter symbol test conditions min ( note 10 )typ max ( note 10 )units dc characteristics supply voltage v in 2.3 6.5 v ground current i dd output enabled; i o = 0a; v in < 4.2v 31 40 a output enabled; i o = 0a; full voltage range 57 a shutdown current i dds 0.5 1.2 a uvlo threshold v uv+ 1.9 2.1 2.3 v v uv- 1.6 1.8 2.0 v regulation voltage accuracy initial accuracy at v in = v o + 0.5v, i o = 10ma, t j = +25 c -0.7 +0.7 % v in = v o + 0.5v to 6.5v, i o = 10a to150ma, t j = +25 c -0.8 +0.8 % v in = v o + 0.5v to 6.5v, i o = 10a to 150ma, t j = -40c to +125c -1.8 +1.8 % maximum output current i max continuous 150 ma internal current limit i lim 175 265 355 ma drop-out voltage ( note 9 )v do1 i o = 150ma; v o ? 2.5v 300 500 mv v do2 i o = 150ma; 2.5v ? v o ? 2.8v 250 400 mv v do3 i o = 150ma; 2.8v ? v o 200 325 mv thermal shutdown temperature t sd+ 140 c t sd- 110 c ac characteristics ripple rejection ( note 8 )i o = 10ma, v in = 2.8v(min), v o = 1.8v, c byp = 0.1f at 1khz 90 db at 10khz 70 db at 100khz 50 db output noise voltage ( note 8 )v o = 1.5v, t a = +25 c, c byp = 0.1f bw = 10hz to 100khz, i o = 100a 20 v rms bw = 10hz to 100khz, i o = 10ma 30 v rms
isl9003a fn6299 rev 5.00 page 4 of 12 july 18, 2014 device start-up characteristics device enable time t en time from assertion of the en pin to when the output voltage reaches 95% of the v o (nom). 250 500 s ldo soft-start ramp rate t ssr slope of linear portion of ldo output voltage ramp during start-up 30 60 s/v en pin characteristics input low voltage v il -0.3 0.4 v input high voltage v ih 1.4 v in + 0.3 v input leakage current i il , i ih 0.1 a pin capacitance c pin informative 5 pf notes: 8. limits established by charac terization and are not production tested. 9. v o = 0.98*v o (nom); valid for v o greater than 1.85v. 10. parameters with min and/or max limits are 100% tested at +25 c, unless otherwise specified. t emperature limits established by characterization and are not production tested. electrical specifications unless otherwise noted, all parameters are guaranteed over the operational supply voltage and temperature range of the device as follows: t a = -40c to +85c; v in = (v o + 0.5v) to 6.5v with a minimum v in of 2.3v; c in =1f; c o = 1f; c byp = 0.01f. (continued) parameter symbol test conditions min ( note 10 )typ max ( note 10 )units typical performance curves figure 1. output voltage vs input voltage (3.3v output) figure 2. output voltage change (%) vs input voltage (3.3v output) output voltage, v o (%) input voltage (v) -0.6 -0.2 0.2 0.6 -0.8 3.8 4.2 6.2 5.8 6.6 3.4 4.6 5.0 5.4 -0.4 0.0 0.4 0.8 v o = 3.3v +85 ? c -40 ? c +25 ? c i load = 0ma output voltage change (%) input voltage (v) v o = 3.3v i o = 0ma i o = 150ma +25c 0.2 0.1 0.0 -0.1 -0.2 -0.3 -0.4 3.3 3.8 4.3 4.8 5.3 5.8 6.3 i o = 75ma
isl9003a fn6299 rev 5.00 page 5 of 12 july 18, 2014 figure 3. output vo ltage vs load current figure 4. output voltage vs temperature figure 5. dropout voltage vs input voltage (3.3v output) figure 6. dropout voltage vs input voltage (2.8v output) figure 7. dropout voltage vs load current figure 8. dropout voltage vs load current typical performance curves (continued) load current - i o (ma) output voltage change (%) +85c -40c +25c 1.0 0.8 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 -0.8 -1.0 0 25 50 75 100 125 150 175 v in = 3.8v v o = 3.3v 0.04 0.06 -0.06 -0.10 -25 0 25 85 -40 temperature ( ? c) output voltage (%) -0.02 0.00 0.02 0.08 0.10 -0.04 -0.08 55 v in = 3.8v v o = 3.3v i o = 0ma i o = 75ma i o = 150ma output voltage, v o (v) input voltage (v) 3.4 3.3 3.2 3.1 3.0 2.9 2.8 2.7 2.6 2.5 2.4 2.3 2.6 3.1 3.6 4.1 4.6 5.1 5.6 6.1 6.6 i o = 150ma i o = 0ma i o = 75ma v o = 3.3v +25c input voltage (v) output voltage, v o (v) v o = 2.8v 2.9 2.8 2.7 2.6 2.5 2.4 2.3 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 i o = 150ma i o = 0ma i o = 75ma +25c output load (ma) v o = 2.8v v o = 3.3v dropout voltage, v do (mv) 250 200 150 100 50 0 0 25 50 75 100 125 150 175 100 125 150 175 75 25 0 25 50 75 100 125 150 175 0 output load (ma) dropout voltage, v do (mv) v o = 3.3v +85 ? c +25 ? c -40 ? c 225 50 200
isl9003a fn6299 rev 5.00 page 6 of 12 july 18, 2014 figure 9. ground current vs input voltage figure 10. ground current vs load figure 11. ground current vs temperature figure 12. turn on/turn off response figure 13. line transient response, 3.3v output figure 14. line transient response, 2.8v output typical performance curves (continued) 10 20 30 40 60 0 2.5 3.5 5.0 input voltage (v) ground current (a) 50 1.5 2.0 3.0 4.0 4.5 -40 ? c +85 ? c 6.0 5.5 6.5 i o = 0a v o = 3.3v +25 ? c 100 20 0 25 50 75 100 125 0 load current (ma) ground current (a) 175 150 v o = 3.3v v in = 3.8v 40 60 80 120 140 +85 ? c -40 ? c +25 ? c 40 20 -20 0 20 60 -40 temperature ( ? c) ground current (a) 60 70 80 50 30 -30 -10 10 40 30 50 70 v in = 3.8v v o = 3.3v 90 100 80 90 i l = 150ma i l = 75ma i l = 0ma 1 3 0 2 0 100 200 300 400 500 600 700 800 0 time (s) v o (v) v en (v) 5 v o = 3.3v v in = 5.0v i l = 150ma c l = 1f 900 1000 400s/div v o = 3.3v i load = 150ma 3.6v 4.3v 10mv/div c load = 1f c byp = 0.01f 400s/div v o = 2.8v i load = 150ma 3.5v 4.2v 10mv/div c load = 1f c byp = 0.01f
isl9003a fn6299 rev 5.00 page 7 of 12 july 18, 2014 figure 15. load transient response figure 16. psrr vs frequency figure 17. spectral noise density vs frequency typical performance curves (continued) 1.0 ms/div vo (10mv/div) i load 100ma 100a v in = 3.8v v o = 3.3v 0.1k 1k 10k 100k 1m frequency (hz) 110 10 20 30 40 50 60 70 80 90 100 psrr (db) v in = 3.9v v o = 1.8v c byp = 0.1f c load = 1f 50ma 10ma spectral noise density ( v/ ? hz ) 2.000 1.000 0.100 0.010 0.001 10 100 1k 10k 100k 1m frequency (hz) v in = 3.9v v o = 1.8v c byp = 0.1f c in = 1f c load = 1f 100a 10ma
isl9003a fn6299 rev 5.00 page 8 of 12 july 18, 2014 pin description typical application 5 ld sc-70 pin number 6 ld tdfn pin number pin name description 16v in supply voltage/ldo input. con nect a 1f capacitor to gnd. 2 2 gnd gnd is the connection to system ground. connect to pcb gro und plane. 3 4 en output enable. when this signal goes high, the ldo is turne d on. 4 3 cbyp reference bypass capacit or pin. optionally connect capaci tor of value 0.01f to 1f between this pin and gnd to tune in the desired noise and psrr performance. 51v o ldo output. connect a 1f c apacitor of value to gnd. - 5 nc no connect. c1, c2: 1f x5r ceramic capacitor isl9003a (sc-70) v in gnd vo cbyp 5 4 1 2 v in (2.3v to 5v) v out c1 c2 en 3 enable off on c3 c3: 0.1f x5r ceramic capacitor c1, c2: 1f x5r ceramic capacitor isl9003a (tdfn) v o gnd v in en 5 4 1 2 v out c1 c2 cbyp 3 enable off on c3 c3: 0.1f x5r ceramic capacitor nc v in (2.3v to 5v) 6
isl9003a fn6299 rev 5.00 page 9 of 12 july 18, 2014 block diagram functional description the isl9003a contains all circui try required to implement a high performance ldo. high performance is achieved through a circuit that delivers fast tra nsient response to varying load conditions. in a quiescent condition, the isl9003a adjusts its biasing to achieve the lowest standby current consumption. the device also integr ates current limit protection, smart thermal shutdown protection, and soft-start. smart thermal shutdown protects the device a gainst overheating. soft-start minimizes start-up input cu rrent surges without causing excessive device turn-on time. power control the isl9003a has an enable pin, (en), to control power to the ldo output. when en is low, t he device is in shutdown mode. in this condition, all on-chip c ircuits are off, and the device draws minimum current, typica lly less than 0.3a. when the en pin goes high, the device fi rst polls the out put of the uvlo detector to ensure th at vin voltage is at least 2.1v (typical). once verified, the device initia tes a start-up sequence. during the start-up sequence, trim sett ings are first read and latched . then, sequentially, the bandgap, reference voltage and current generation circuitry turn-on. onc e the references are stable, the ldo powers-up. during operation, whenever the vin voltage drops below about 1.84v, the isl9003a immediatel y disables the ldo output. when vin rises back above 2. 1v (assuming the en pin is high), the device re-initiates its start-up sequence and ldo operation resumes automatically. reference generation the reference generation ci rcuitry includes a trimmed bandgap, a trimmed voltage reference divider, a trimmed current reference generator, and an rc noise filter. the filter includes the external capacitor connected to the cbyp pin. a 0.01f capacitor connected cbyp implements a 100hz lowpass filter, and is recommended for most high performance applications. for the lowest noise application, a 0.1 f or greater cbyp capacito r should be used. this filters the reference noise to below the 10hz to 1khz frequency band, which is crucial in many noi se-sensitive applications. the bandgap generates a zero temperature coefficient (tc) voltage for the regulator reference and other voltage references required for current generation and over-temperature detection. a current generator provides ref erences required for adaptive biasing as well as references for ldo output cu rrent limit and thermal shutdown determination. ldo regulation and program mable output divider the ldo regulator is impl emented with a high-gain operational amplifier driving a pmos pass transistor. the design of the isl9003a provides a regulator that has low quiescent current, fast transi ent response, and overall stabili ty across all operating and load cu rrent conditions. ldo stability is guaranteed for a 1f to 4.7f output cap acitor that has a tolerance better than 20% and esr less than 200m ? . the design is performance-optimized for a 1f capacitor. unless limited by the application, use of an output capacitor value above 4.7f is not recomm ended as ldo performance improvement is minimal. soft-start circuitry integrated into ea ch ldo limits the initial ramp-up rate to about 30s/v to minimize current surge. the isl9003a provides short-circuit protection by limiting the output cur rent to about 265ma (typ). v o gnd bandgap and temperature sensor uvlo v in sd control logic voltage and reference generator cbyp 1.0v 0.94v 0.9v gnd short circuit, thermal protection, soft-start + -
fn6299 rev 5.00 page 10 of 12 july 18, 2014 isl9003a intersil products are manufactured, assembled and tested utilizing iso9001 quality systems as noted in the quality certifications found at www.intersil.com/en/suppor t/qualandreliability.html intersil products are sold by description on ly. intersil may modify the circuit design an d/or specifications of products at any time without notice, provided that such modification does not, in intersil's sole judgment, affect the form, fit or function of the product. accordingly, the reader is cautioned to verify that datasheets are current before placing orders. information fu rnished by intersil is believed to be accu rate and reliable. however, no responsib ility is assumed by intersil or its subsidiaries for its use; nor for any infrin gements of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiaries. for information regarding intersil corporation and its products, see www.intersil.com for additional products, see www.intersil.com/en/products.html ? copyright intersil americas llc 2006-2014. all rights reserved. all trademarks and registered trademarks are the property of their respective owners. the ldo uses an independently trimmed 1v reference as its input. an internal resistor divider drops the ldo output voltage down to 1v. this is compared to the 1v reference for regulation. the resistor divis ion ratio is programmed in the factory. overheat detection the bandgap outputs a proportional-to-temperature current that is indicative of the tempe rature of the silicon. this current is compared with refe rences to determine if the device is in danger of damage due to overheating. when the die temperature reaches about +140 c , the ldo momentarily shuts down until the die cools sufficiently. in the overheat condition, if the ldo sources more than 50ma it will be shut off. once the die temperature falls back below about +110 c , the disabled ldo is re-enabled and soft-start automatically takes place. exposed thermal pad the isl9003a with tdfn p ackage has an exposed thermal pad at the bottom si de of the package. the pcb layout should connect the ex posed pad to some copper on the component layer for a good thermal conductivity. since the copper area on the component layer is limited by the surrounding pins of the package , it is more effective to use some thermal vias to conduct the heat to other copper layers if possible. electrically the cop per and vias connecti ng to the exposed pad should be isolated from any other pin connection, they are strictly for therma l enhancement purpose.
isl9003a fn6299 rev 5.00 page 11 of 12 july 18, 2014 small outline transistor plastic packages (sc70-5) d e 1 e e1 c l c c l e b c l a2 a a1 c l 0.20 (0.008) m 0.10 (0.004) c c -c- seating plane 4 5 123 view c view c l r1 r 4x ? 1 4x ? 1 gauge plane l1 seating ? l2 c plane c base metal with c1 b1 plating b 0.4mm 0.75mm 0.65mm 2.1mm typical recommended land pattern p5.049 5 lead small outline transistor plastic package symbol inches millimeters notes min max min max a 0.031 0.043 0.80 1.10 - a1 0.000 0.004 0.00 0.10 - a2 0.031 0.039 0.80 1.00 - b 0.006 0.012 0.15 0.30 - b1 0.006 0.010 0.15 0.25 c 0.003 0.009 0.08 0.22 6 c1 0.003 0.009 0.08 0.20 6 d 0.073 0.085 1.85 2.15 3 e 0.071 0.094 1.80 2.40 - e1 0.045 0.053 1.15 1.35 3 e 0.0256 ref 0.65 ref - e1 0.0512 ref 1.30 ref - l 0.010 0.018 0.26 0.46 4 l1 0.017 ref. 0.420 ref. - l2 0.006 bsc 0.15 bsc ? 0 o 8 o 0 o 8 o - n5 55 r 0.004 - 0.10 - r1 0.004 0.010 0.15 0.25 rev. 3 7/07 notes: 1. dimensioning and tolerances per asme y14.5m-1994. 2. package conforms to eiaj sc70 and jedec mo-203aa. 3. dimensions d and e1 are exclusiv e of mold flash, protrusions, or gate burrs. 4. footlength l measured at reference to gauge plane. 5. ?n? is the number of terminal positions. 6. these dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip. 7. controlling dimension: millime ter. converted inch dimen- sions are for reference only.
isl9003a fn6299 rev 5.00 page 12 of 12 july 18, 2014 ultra thin dual flat no-l ead plastic package (utdfn) b d a e 0.15 c 2x pin 1 top view 0.15 c 2x reference detail a 0.10 c 0.08 c 6x a3 c seating plane l e 46 31 bottom view side view 0.10 cab b6x detail a 0.127 +0.058 a1 a1 a 0.1270.008 64 13 m co.2 1.00 ref d2 dap size 1.30 x 0.76 e2 -0.008 terminal thickness 0.30 1.00 0.45 0.50 0.25 1.25 2.00 1.00 land pattern 6 l6.1.6x1.6a 6 lead ultra thin dual flat no-lead plastic package symbol millimeters notes min nominal max a 0.45 0.50 0.55 - a1 - - 0.05 - a3 0.127 ref - b 0.15 0.20 0.25 - d 1.55 1.60 1.65 4 d2 0.40 0.45 0.50 - e 1.55 1.60 1.65 4 e2 0.95 1.00 1.05 - e 0.50 bsc - l 0.25 0.30 0.35 - rev. 1 6/06 notes: 1. dimensions are in mm. angles in degrees. 2. coplanarity applies to the exposed pad as well as the terminals. coplanarity shall not exceed 0.08mm. 3. warpage shall not exceed 0.10mm. 4. package length/package width are considered as special characteristics. 5. jedec reference mo-229. 6. for additional information, to assist with the pcb land patte rn design effort, see intersil technical brief tb389 .

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